Assembly and Package are the two core processes of electronic manufacturing, involving many complex and key technologies, including materials, processes, equipment, design, reliability analysis of detection and so on. Huabi Laboratory Reliability and Failure Analysis Division, with a professional team, has established a perfect technical support service system around the requirements of electronic manufacturing, escorted the manufacturing of electronic information products, and solved many key technical requirements for the industry. At the same time, in order to ensure the leading level of manufacturing technology services, we have been in close technical exchanges and cooperation with many institutions and organizations in the industry, such as IPC, IEC and SMT associations.
Comprehensive technology capabilities
Electronic technology material testing analysis
A comprehensive analysis of the performance and reliability parameters of the materials involved in the manufacturing process can be carried out according to various technical standards.
Detection: Solder Used Solder Solder Wire Solder Paste Flux Detergent Adhesive PCB
Components Manufacturability Evaluation
Solderability Heat Endurance Tin Whisker MSL Resistance to Dissolution of Metallization
PCB PCBA lead-free solder joints Package
Reliability Analysis & Evaluation
Lead-free Solder Joints Lead-free Components Lead-free PCBA
Lead-free Process Consultation
Process Optimizing Materials Choice Process Control